| Abstract |
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Recently MEMS Capacitive Pressure Sensor gains more advantage over micromachined piezoresistive pressure sensor due to high sensitivity, low power consumption, free from temperature effects, IC compatibility, etc,. The spectrum of capacitive pressure sensor application is increasing, hence it is essential to review the path of technological development and further prospective of micromachined capacitive pressure sensor. This paper focuses on the review of various types of capacitive pressure sensor principle, MEMS materials used in fabrication, procedures adopted in microfabrication for silicon and polymer material diaphragm, bonding and packaging techniques used. Selected result on capacitive sensitivity, effect of temperature on capacitive sensitivity was also presented. Finally, the development of smart sensor was discussed. |
