| Abstract |
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In electronic devices systems, the average lifetime could be expected based on handling enormous populations of components probabilistically. Time dependency of reliability was understood by the description, and therefore the time variables appeared in all of the failure distribution purposes that would be consequently. The research will be a specified test system or operating conditions that are necessary to predict reliability. At start of study COMSOL Multiphysics Modeling Software to solve model which indicated the effect of higher temperature by climate or run on the electronic chip. To demonstrate the reason, which may cause the collapse of the device, especially in the country where the climate was hot at certain times of the year such as one of the reasons public and which accelerate the collapse of the systems. Electronic devices had a big difference when tested under the influence of temperature. Significant technical terms related to engineering reliability and having different significances were taking into consideration such as availability, maintainability, and survivability. Probability of collapse was a measured of the reform components will work for a while. Collapse consists of transition from reliability to the case of failure. Regardless of specific mechanism, failure almost always starts off by the movement of time independent of ions and atoms or electronic charge from the benign side to the harmful side. The main problem of the research was how to evaluate a good case for electronic devices operating system by estimating reliability. Data analyzed with support Weibull++/ALTA 9 and BlockSim 9 software and algorithms reliability. Sample reliability with the appropriate had been estimated input parameters for this models (such as failure rates for non-specific situation or event and at the same time to reform the system for the failure of a particular). To provide a system (or part) to estimate the level of reliability of the output parameters (Availability of the system or frequency specific functional failure). Some probability distributions had been presenting such as Weibull, Gumbel and gamma .A comparison between the different distributions to ensure the effectiveness of one of them to determine the reliability of engineering and electronics systems would be derived authority functions and features of the distribution of thermal stress also. Finally cost factors was used to estimate the target reliability for a product and calculate the return on an investment intended to influence that reliability. |
